TThe unique mechanical feature of MiniSKiiP modules is the outstandingly easy assembly and service friendly spring contact technology. Compared to conventional solder or press-fit modules, where specific equipment (automated presses, wave soldering machine) is required, no dedicated tools are needed for MiniSKiiP assembly. Instead, a single or a two screw connection is used.
The printed circuit board (PCB), the power module and the heat sink are assembled in one mounting step. This connection technology features a number of additional advantages: the PCB can be more flexible in design, as the printed circuit board does not need to include holes for solder pins or pressfit connections. The springs provide a flexible connection between the PCB and the power circuitry which is far superior to a soldered joint, particularly under thermal or mechanical stress conditions which can affect lifetime. Thanks to the high mechanical pressure provided by the springs, an air-tight, reliable electrical connection is achieved.
With two decades of field experience and more than 45 million modules in the field, this module platform has proven successful in all standard applications. Key applications include all kinds of inverters, such as motor and servo drives, solar inverters with 1000VDC and 1500VDC, UPS systems and welding machines. Thanks to the excellent reliability of spring contacts, applications such as agricultural vehicles or yaw and pitch drives in wind turbines benefit from MiniSKiiP technology as well.
Benefits The SEMITOP platform centers around 12-mm-high modules, covering the low and medium-power range, with one or two mounting screws and no baseplate, featuring PCB interface via solder or press-fit pins. The low commutation inductance design and the choice of the latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies, welding and the new EV battery charger market. A large variety of configurations is possible within the SEMITOP family, including 3-level (NPC/TNPC) and CIB (converter-inverter-brake) topologies.
The SEMITOP family features a cost effective design. This product generation is designed for the low and medium power range of up to 200kW following the latest introduction of the SEMITOP E family. The scope this gives for compact and low inductance designs, coupled with the latest chip technologies and different topologies, makes the two platforms suitable for different markets such as UPS, solar, motor drives, power supplies and the new, emerging EV battery charger market.
Benefits SEMITRANS 2-9 feature well-proven designs that come from over 30 years of market experience, but are still suitable for the latest generation of chips, including silicon carbide, thanks to its low-inductance design. SEMITRANS 10 takes the power range into the realm of megawatt applications, not only with half-bridge, but also in 3-level topologies for wind and solar applications. SEMITRANS 20 serves low and medium-voltage applications with a low-inductance and easy-to-parallel power module design. With its advanced technologies such as sintered chips and AlCu bond wires, it boasts up to 5 time more lifetime than standard modules.
SEMITRANS power modules are designed for a broad range of applications such as motor drives, regenerative inverters, power supplies or traction applications. The long service life is perfectly suited to ambitious applications such as AC drives, switched reluctance and DC motors.